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           BAS16LD All information provided in this document is subject to legal disclaimers. ? NXP B.V. 2010. All rights reserved. Product data sheet Rev. 1 — 12 October 2010 7 of 11 NXP Semiconductors BAS16LD Single high-speed switching diode 9. Package outline 10. Packing information [1] For further information and the availability of packing methods, see Section 14. 11. Soldering Fig 8. Package outline BAS16LD (SOD882D) 10-08-06 Dimensions in mm 0.65 0.30 0.22 0.30 0.22 0.55 0.45 0.65 0.55 0.4 max 1.05 0.95 2 cathode marking on top side 1 Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 10000 BAS16LD SOD882D 2 mm pitch, 8 mm tape and reel -315 Reflow soldering is the only recommended soldering method. Fig 9. Reflow soldering footprint BAS16LD (SOD882D) solder lands solder resist solder paste sod882d_fr Dimensions in mm 1.4 0.2 0.3 0.4 1 1.3 0.8 (2×) 0.6 (2×) (2×) 0.7 |